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Thermally conductive support structureA structure for supporting and at least transferring heat energy away from at least a first heat source interconnected thereto is disclosed. In one embodiment, the structure includes a deck member having a plurality of layers of thermally conductive fibers packed within a matrix material. Fibers of at least a first layer are orientable to transfer heat energy toward at least a first sidewall of the deck member, and fibers of at least a second layer are orientable about .+-.45.degree. relative to the fibers of the first layer to enhance the structural strength of the deck member. In another embodiment, fibers of at least a first layer of thermally conductive fibers of the deck member are orientable to transfer heat energy from a first heat source to a second, cooler heat source, both of which are interconnectable to the deck member, such that the first and second heat sources operate at substantially uniform temperatures. In this embodiment, fibers of at least a second layer of thermally conductive fibers are orientable about .+-.45.degree. relative to the fibers of the first layer to enhance the structural strength of the deck member. Fibers of at least a third layer of thermally conductive fibers are orientable substantially orthogonally relative to the fibers of the first layer to transfer heat energy away from at least the first heat source to at least a first sidewall of the deck member.
Document ID
20080004058
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - Patent
Authors
Herzl, Alfred
Date Acquired
August 24, 2013
Publication Date
August 15, 2000
Subject Category
Fluid Mechanics And Thermodynamics
Report/Patent Number
Patent Number: US-PATENT-6,102,112
Patent Application Number: US-PATENT-APPL-SN-027830
Funding Number(s)
CONTRACT_GRANT: NAS7-1260
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-6,102,112
Patent Application
US-PATENT-APPL-SN-027830
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