NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
Multi-wafer slicing with a fixed abrasiveA wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.
Document ID
20080004089
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - Patent
Authors
Schmid, Frederick
Khattak, Chandra P.
Smith, Maynard B.
Date Acquired
August 24, 2013
Publication Date
March 1, 1988
Subject Category
Mechanical Engineering
Report/Patent Number
Patent Number: US-PATENT-4,727,852
Patent Application Number: US-PATENT-APPL-SN-762493
Funding Number(s)
CONTRACT_GRANT: NAS7-100
CONTRACT_GRANT: JPL-954373
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-4,727,852
Patent Application
US-PATENT-APPL-SN-762493

Related Records

There are no records associated with this record.
No Preview Available