Device and method for measuring thermal conductivity of thin films

A device and method are provided for measuring the thermal conductivity of rigid or flexible, homogeneous or heterogeneous, thin films between 50 .mu.m and 150 .mu.m thick with relative standard deviations of less than five percent. The specimen is sandwiched between like material, highly conductive upper and lower slabs. Each slab is instrumented with six thermocouples embedded within the slab and flush with their corresponding surfaces. A heat source heats the lower slab and a heat sink cools the upper slab. The heat sink also provides sufficient contact pressure onto the specimen. Testing is performed within a vacuum environment (bell-jar) between 10.sup.-3 to 10.sup.-6 Torr. An anti-radiant shield on the interior surface of the bell-jar is used to avoid radiation heat losses. Insulation is placed adjacent to the heat source and adjacent to the heat sink to prevent conduction losses. A temperature controlled water circulator circulates water from a constant temperature bath through the heat sink. Fourier's one-dimensional law of heat conduction is the governing equation. Data, including temperatures, are measured with a multi-channel data acquisition system. On-line computer processing is used for thermal conductivity calculations.