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Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chipA computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.
Document ID
20080004431
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - Patent
Authors
Carson, John C.
Indin, Ronald J.
Shanken, Stuart N.
Date Acquired
August 24, 2013
Publication Date
September 13, 1994
Subject Category
Computer Operations And Hardware
Report/Patent Number
Patent Number: US-PATENT-5,347,428
Patent Application Number: US-PATENT-APPL-SN-985837
Funding Number(s)
CONTRACT_GRANT: NAS7-1118
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-5,347,428
Patent Application
US-PATENT-APPL-SN-985837

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