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Non-contact thickness measurement using UTGA measurement structure for determining the thickness of a specimen without mechanical contact but instead employing ultrasonic waves including an ultrasonic transducer and an ultrasonic delay line connected to the transducer by a retainer or collar. The specimen, whose thickness is to be measured, is positioned below the delay line. On the upper surface of the specimen a medium such as a drop of water is disposed which functions to couple the ultrasonic waves from the delay line to the specimen. A receiver device, which may be an ultrasonic thickness gauge, receives reflected ultrasonic waves reflected from the upper and lower surface of the specimen and determines the thickness of the specimen based on the time spacing of the reflected waves.
Document ID
20080004853
Acquisition Source
Marshall Space Flight Center
Document Type
Other - Patent
Authors
Bui, Hoa T.
Date Acquired
August 24, 2013
Publication Date
December 17, 1996
Subject Category
Instrumentation And Photography
Funding Number(s)
CONTRACT_GRANT: NAS8-37710
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-5,585,563
Patent Application
US-PATENT-APPL-SN-094664
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