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Method and apparatus for thermographically and quantitatively analyzing a structure for disbonds and/or inclusionsA heat source such as a magnetic induction/eddy current generator remotely heats a region of a surface of a test structure to a desired depth. For example, the frequency of the heating source can be varied to heat to the desired depth. A thermal sensor senses temperature changes in the heated region as a function of time. A computer compares these sensed temperature changes with calibration standards of a similar sample having known disbond and/or inclusion geography(ies) to analyze the test structure. A plurality of sensors can be arranged linearly to sense vector heat flow.
Document ID
20080004863
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Heyman, Joseph S.
Winfree, William P.
Cramer, K. Elliott
Zalamedia, Joseph N.
Date Acquired
August 24, 2013
Publication Date
October 8, 1996
Subject Category
Fluid Mechanics And Thermodynamics
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-571688
Patent Number: US-PATENT-5,562,345
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-5,562,345
Patent Application
US-PATENT-APPL-SN-571688
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