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Three-dimensional modular electronic interconnection systemA three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector. The device includes internal space to allow room for circuitry. The device is formed by stacking an electronics module, an elastomeric interface board on the electronics module such that the interface board's exterior makes electrical connection with the connectors around the perimeter of the interface board, but the internal portion is open to allow room for the electrical devices on the printed wiring board. A plurality of these devices are stacked between a top stiffener and a bottom device, and held into place by alignment elements.
Document ID
20080004915
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Bolotin, Gary S.
Cardone, John
Date Acquired
August 24, 2013
Publication Date
March 27, 2001
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-165175
Patent Number: US-PATENT-6,206,705
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-6,206,705
Patent Application
US-PATENT-APPL-SN-165175
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