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Tough, processable simultaneous semi-interpenetrating polyimidesA high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.
Document ID
20080005972
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Pater, Ruth H.
Date Acquired
August 24, 2013
Publication Date
February 20, 1996
Subject Category
Nonmetallic Materials
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-222761
Patent Number: US-PATENT-5,492,979
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-5,492,979
Patent Application
US-PATENT-APPL-SN-222761
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