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Microwave bonding of MEMS componentBonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.
Document ID
20080007011
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - Patent
Authors
Barmatz, Martin B.
Mai, John D.
Jackson, Henry W.
Budraa, Nasser K.
Pike, William T.
Date Acquired
August 24, 2013
Publication Date
June 14, 2005
Subject Category
Solid-State Physics
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-198656
Patent Number: US-PATENT-6,905,945
Funding Number(s)
CONTRACT_GRANT: NAG7-1407
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-6,905,945
Patent Application
US-PATENT-APPL-SN-198656

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