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Graded junction termination extensions for electronic devicesA graded junction termination extension in a silicon carbide (SiC) semiconductor device and method of its fabrication using ion implementation techniques is provided for high power devices. The properties of silicon carbide (SiC) make this wide band gap semiconductor a promising material for high power devices. This potential is demonstrated in various devices such as p-n diodes, Schottky diodes, bipolar junction transistors, thyristors, etc. These devices require adequate and affordable termination techniques to reduce leakage current and increase breakdown voltage in order to maximize power handling capabilities. The graded junction termination extension disclosed is effective, self-aligned, and simplifies the implementation process.
Document ID
20080008683
Acquisition Source
Glenn Research Center
Document Type
Other - Patent
Authors
Merrett, J. Neil
Isaacs-Smith, Tamara
Sheridan, David C.
Williams, John R.
Date Acquired
August 24, 2013
Publication Date
April 25, 2006
Subject Category
Solid-State Physics
Report/Patent Number
Patent Application Number: US-Patent-Appl-SN-10/324,564
Patent Number: US-Patent-7,033,950
Funding Number(s)
CONTRACT_GRANT: NCC3-511
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-7,033,950
Patent Application
US-Patent-Appl-SN-10/324,564
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