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Conductively cooled microchannel platesA conductively cooled microchannel plate is disclosed. Cooling is achieved by placing an active face of the MCP in thermal contact with a thermally conductive substrate for dissipating joule heating.
Document ID
20080008754
Acquisition Source
Langley Research Center
Document Type
Other - Patent
Authors
Feller, Winthrop B.
Date Acquired
August 24, 2013
Publication Date
August 14, 1990
Subject Category
Physics Of Elementary Particles And Fields
Report/Patent Number
Patent Number: US-Patent-4,948,965
Patent Application Number: US-Patent-Appl-SN-309195
Funding Number(s)
CONTRACT_GRANT: NAS1-18482
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-4,948,965
Patent Application
US-Patent-Appl-SN-309195

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