NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Press Enter or click the Search button to begin your search.

Back to Results
Multi-Evaporator Miniature Loop Heat Pipe for Small Spacecraft Thermal ControlThis paper presents the development of the Thermal Loop experiment under NASA's New Millennium Program Space Technology 8 (ST8) Project. The Thermal Loop experiment was originally planned for validating in space an advanced heat transport system consisting of a miniature loop heat pipe (MLHP) with multiple evaporators and multiple condensers. Details of the thermal loop concept, technical advances and benefits, Level 1 requirements and the technology validation approach are described. An MLHP breadboard has been built and tested in the laboratory and thermal vacuum environments, and has demonstrated excellent performance that met or exceeded the design requirements. The MLHP retains all features of state-of-the-art loop heat pipes and offers additional advantages to enhance the functionality, performance, versatility, and reliability of the system. In addition, an analytical model has been developed to simulate the steady state and transient operation of the MHLP, and the model predictions agreed very well with experimental results. A protoflight MLHP has been built and is being tested in a thermal vacuum chamber to validate its performance and technical readiness for a flight experiment.
Document ID
20080032843
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Ku, Jentung
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Ottenstein, Laura
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Douglas, Donya
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 24, 2013
Publication Date
April 7, 2008
Subject Category
Spacecraft Design, Testing And Performance
Meeting Information
Meeting: 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference
Location: Illinois
Country: United States
Start Date: April 7, 2008
End Date: April 10, 2008
Sponsors: American Society of Civil Engineers, American Society for Composites, American Inst. of Aeronautics and Astronautics, American Society of Mechanical Engineers, American Helicopter Society, Inc.
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
No Preview Available