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Submillimeter-Wave Amplifier Module with Integrated Waveguide TransitionsTo increase the usefulness of monolithic millimeter-wave integrated circuit (MMIC) components at submillimeter-wave frequencies, a chip has been designed that incorporates two integrated, radial E-plane probes with an MMIC amplifier in between, thus creating a fully integrated waveguide module. The integrated amplifier chip has been fabricated in 35-nm gate length InP high-electron-mobility-transistor (HEMT) technology. The radial probes were mated to grounded coplanar waveguide input and output lines in the internal amplifier. The total length of the internal HEMT amplifier is 550 m, while the total integrated chip length is 1,085 m. The chip thickness is 50 m with the chip width being 320 m. The internal MMIC amplifier is biased through wire-bond connections to the gates and drains of the chip. The chip has 3 stages, employing 35-nm gate length transistors in each stage. Wire bonds from the DC drain and gate pads are connected to off-chip shunt 51-pF capacitors, and additional off-chip capacitors and resistors are added to the gate and drain bias lines for low-frequency stability of the amplifier. Additionally, bond wires to the grounded coplanar waveguide pads at the RF input and output of the internal amplifier are added to ensure good ground connections to the waveguide package. The S-parameters of the module, not corrected for input or output waveguide loss, are measured at the waveguide flange edges. The amplifier module has over 10 dB of gain from 290 to 330 GHz, with a peak gain of over 14 dB at 307 GHz. The WR2.2 waveguide cutoff is again observed at 268 GHz. The module is biased at a drain current of 27 mA, a drain voltage of 1.24 V, and a gate voltage of +0.21 V. Return loss of the module is very good between 5 to 25 dB. This result illustrates the usefulness of the integrated radial probe transition, and the wide (over 10-percent) bandwidth that one can expect for amplifier modules with integrated radial probes in the submillimeter-regime (>300 GHz).
Document ID
20090008431
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - NASA Tech Brief
Authors
Samoska, Lorene
(California Inst. of Tech. Pasadena, CA, United States)
Chattopadhyay, Goutam
(California Inst. of Tech. Pasadena, CA, United States)
Pukala, David
(California Inst. of Tech. Pasadena, CA, United States)
Gaier, Todd
(California Inst. of Tech. Pasadena, CA, United States)
Soria, Mary
(California Inst. of Tech. Pasadena, CA, United States)
ManFung, King
(California Inst. of Tech. Pasadena, CA, United States)
Deal, William
(Northrop Grumman Corp. United States)
Mei, Gerry
(Northrop Grumman Corp. United States)
Radisic, Vesna
(Northrop Grumman Corp. United States)
Lai, Richard
(Northrop Grumman Corp. United States)
Date Acquired
August 24, 2013
Publication Date
January 1, 2009
Publication Information
Publication: NASA Tech Briefs, January 2009
Subject Category
Documentation And Information Science
Report/Patent Number
NPO-45088
Funding Number(s)
CONTRACT_GRANT: DARPA MIPR 06-U037
CONTRACT_GRANT: W911Q-06-C-0050
Distribution Limits
Public
Copyright
Public Use Permitted.
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