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Packaging Concerns/Techniques for Large DevicesThis slide presentation reviews packaging challenges and options for electronic parts. The presentation includes information about non-hermetic packages, space challenges for packaging and complex package variations.
Document ID
20090043015
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Sampson, Michael J.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 24, 2013
Publication Date
August 31, 2009
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: Presentation on Military and Aerospace Programmable Logic Devices (MAPLD)
Location: Greenbelt, MD
Country: United States
Start Date: August 31, 2009
Sponsors: NASA Goddard Space Flight Center
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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