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Packaging Concerns and Techniques for Large Devices: Challenges for Complex ElectronicsNASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.
Document ID
20100015703
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
LaBel, Kenneth A.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Sampson, Michael J.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 24, 2013
Publication Date
February 9, 2010
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: Components for Military and Space Electronics (CMSE)
Location: Los Angeles, CA
Country: United States
Start Date: February 8, 2010
End Date: February 11, 2010
Sponsors: Components Technology Inst., Inc.
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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