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Packaging and Embedded Electronics for the Next GenerationThis viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.
Document ID
20100025537
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Sampson, Michael J.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 24, 2013
Publication Date
June 22, 2010
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: 1st NASA Electronic Parts and Packaging (NEPP) Program: Electronic Technology Workshop
Location: Greenbelt, MD
Country: United States
Start Date: June 22, 2010
End Date: June 24, 2010
Sponsors: NASA Goddard Space Flight Center
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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