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Working with Consortia - Advanced Packaging ReliabilityDescription: Support the responsible NASA official for lead-free solder evaluation. Serve as the NASA technical liaison to the NASA/DoD Pb-free Project. Assure NASA areas of interest are included in JG-PP follow-on work. Support NASA/DoD telcons and face-to-face meetings. Update MSFC lead-free solder lessons learned report. FY10 plans: - Reliability data on lead-free solder applications for various part lead finishes and board finishes. - Update lead-free solder risks and risk mitigation strategies for NASA. - Evaluate lead-free alloy/lead-free finish reliability in design application. - Status CAVE project on Pb-free solder aging effects. - Compile the LTESE flight and bench data.
Document ID
20100028376
Acquisition Source
Marshall Space Flight Center
Document Type
Presentation
Authors
Blanche, Jim
(Jacobs Technologies Engineering Science Contract Group Huntsville, AL, United States)
Strickland, Mark
(NASA Marshall Space Flight Center Huntsville, AL, United States)
Date Acquired
August 24, 2013
Publication Date
June 22, 2010
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: 2010 NEPP Electronics Technology Workshop
Location: Greenbelt, MD
Country: United States
Start Date: June 22, 2010
End Date: June 24, 2010
Distribution Limits
Public
Copyright
Public Use Permitted.
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