Heat Transfer Measurement and Modeling in Rigid High-Temperature Reusable Surface Insulation TilesHeat transfer in rigid reusable surface insulations was investigated. Steady-state thermal conductivity measurements in a vacuum were used to determine the combined contribution of radiation and solid conduction components of heat transfer. Thermal conductivity measurements at higher pressures were then used to estimate the effective insulation characteristic length for gas conduction modeling. The thermal conductivity of the insulation can then be estimated at any temperature and pressure in any gaseous media. The methodology was validated by comparing estimated thermal conductivities with published data on a rigid high-temperature silica reusable surface insulation tile. The methodology was also applied to the alumina enhanced thermal barrier tiles. Thermal contact resistance for thermal conductivity measurements on rigid tiles was also investigated. A technique was developed to effectively eliminate thermal contact resistance on the rigid tile s cold-side surface for the thermal conductivity measurements.
Document ID
20110002877
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Daryabeigi, Kamran (NASA Langley Research Center Hampton, VA, United States)
Knutson, Jeffrey R. (NASA Langley Research Center Hampton, VA, United States)
Cunnington, George R. (Cummington and Associates Palo Alto, CA, United States)
Date Acquired
August 25, 2013
Publication Date
January 4, 2011
Subject Category
Fluid Mechanics And Thermodynamics
Report/Patent Number
NF1676L-10857AIAA Paper 2011-0345Report Number: NF1676L-10857Report Number: AIAA Paper 2011-0345
Meeting Information
Meeting: 49th AIAA Aerospace Sciences Meeting
Location: Orlando, FL
Country: United States
Start Date: January 4, 2011
End Date: January 7, 2011
Sponsors: American Inst. of Aeronautics and Astronautics