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Soil Moisture Active Passive (SMAP) Calibration and Validation Plan and Current ActivitiesThe primary objective of the SMAP calibration and validation (Cal/Val) program is demonstrating that the science requirements (product accuracy and bias) have been met over the mission life. This begins during pre-launch with activities that contribute to high quality products and establishing post-launch validation infrastructure and continues through the mission life. However, the major focus is on a relatively short Cal/Val period following launch. The general approach and elements of the SMAP Cal/Val plan will be described and along with details on several ongoing or recent field experiments designed to address both near- and long-term Cal/Val.
Document ID
20110011769
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Jackson, T. J.
(Department of Agriculture Beltsville, MD, United States)
Cosh, M.
(Department of Agriculture Beltsville, MD, United States)
Bindlish, R.
(Department of Agriculture Beltsville, MD, United States)
Crow, W.
(Department of Agriculture Beltsville, MD, United States)
Colliander, A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Njoku, E.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
McDonald, K.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Kimball, J.
(Montana Univ. MT, United States)
Belair, S.
(Environment Canada Montreal, Quebec, Canada)
Walker, J.
(Melbourne Univ. Australia)
Entekhabi, P.
(Massachusetts Inst. of Tech. Cambridge, MA, United States)
O'Neill, P.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 25, 2013
Publication Date
July 25, 2010
Subject Category
Geosciences (General)
Report/Patent Number
GSFC.CP.4283.2011
Report Number: GSFC.CP.4283.2011
Meeting Information
Meeting: 2010 IEEE International Geoscience and Remote Sensing Symposium (IGARSS 2010)
Location: Honolulu, HI
Country: United States
Start Date: July 25, 2010
End Date: July 30, 2010
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Public Use Permitted.
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