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Front-Side Microstrip Line Feeding a Raised Antenna PatchAn improved design concept for a printed-circuit patch antenna and the transmission line that feeds the patch calls for (1) a microstrip transmission line on the front (radiative) side of a printed-circuit board based on a thin, high-permittivity dielectric substrate; (2) using the conductor covering the back side of the circuit board as a common ground plane for both the microstrip line and the antenna patch; (3) supporting the antenna patch in front of the circuit board on a much thicker, lower-permittivity dielectric spacer layer; and (4) connecting the microstrip transmission line to the patch by use of a thin wire or narrow ribbon that extends through the thickness of the spacer and is oriented perpendicularly to the circuit-board plane. The thickness of the substrate is typically chosen so that a microstrip transmission line of practical width has an impedance between 50 and 100 ohms. The advantages of this design concept are best understood in the context of the disadvantages of prior design concepts, as explained
Document ID
20110015118
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other - NASA Tech Brief
Authors
Hodges, Richard
(California Inst. of Tech. Pasadena, CA, United States)
Hoppe, Daniel
(California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
August 25, 2013
Publication Date
September 1, 2005
Publication Information
Publication: NASA Tech Briefs, September 2005
Subject Category
Communications And Radar
Report/Patent Number
NPO-30605
Distribution Limits
Public
Copyright
Public Use Permitted.
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