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Effect of Post-HALT Annealing on Leakage Currents in Solid Tantalum CapacitorsDegradation of leakage currents is often observed during life testing of tantalum capacitors and is sometimes attributed to the field-induced crystallization in amorphous anodic tantalum pentoxide dielectrics. However, degradation of leakage currents and the possibility of annealing of degraded capacitors have not been investigated yet. In this work the effect of annealing after highly accelerated life testing (HALT) on leakage currents in various types of solid tantalum capacitors was analyzed. Variations of leakage currents with time during annealing at temperatures from 125 oC to 180 oC, thermally stimulated depolarization (TSD) currents, and I-V characteristics were measured to understand the conduction mechanism and the reason for current degradation. Annealing resulted in a gradual decrease of leakage currents and restored their initial values. Repeat HALT after annealing resulted in reproducible degradation of leakage currents. The observed results are explained based on ionic charge instability (drift/diffusion of oxygen vacancies) in the tantalum pentoxide dielectrics using a modified Schottky conduction mechanism.
Document ID
20110015267
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Teverovsky, Alexander
(Dell Perot Systems Greenbelt, MD, United States)
Date Acquired
August 25, 2013
Publication Date
March 15, 2010
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
GSFC.CPR.4861.2011
Report Number: GSFC.CPR.4861.2011
Meeting Information
Meeting: Capacitors and Resistors Technology Symposium (CARTS) Conference
Location: New Orleans, LA
Country: United States
Start Date: March 15, 2010
End Date: March 18, 2010
Distribution Limits
Public
Copyright
Public Use Permitted.
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