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NASA-DoD Lead-Free Electronics ProjectOriginal Equipment Manufacturers (OEMs). depots. and support contractors have to be prepared to deal with an electronics supply chain thaI increasingly provides parts with lead-free finishes. some labeled no differently and intenningled with their SnPb counterparts. Allowance oflead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free lenninations, tennination finishes, or circuit boards presents a host of concerns to customers. suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers; 2. Incompatibility oflead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system; and 3. Unknown material properties and incompatibilities that could reduce solder joint re liability.
Document ID
20110016209
Acquisition Source
Kennedy Space Center
Document Type
Presentation
Authors
Kessel, Kurt
(International Trade Bridge, Inc. Cocoa Beach, FL, United States)
Date Acquired
August 25, 2013
Publication Date
September 27, 2011
Subject Category
Metals And Metallic Materials
Report/Patent Number
KSC-2011-240
Report Number: KSC-2011-240
Meeting Information
Meeting: 2011 Pb-Free Electronics Risk Management Consortium (PERM) Meeting No. 10
Location: Crane, IN
Country: United States
Start Date: September 27, 2011
End Date: September 29, 2011
Sponsors: Aerospace Industries Association
Funding Number(s)
CONTRACT_GRANT: NNH09CF09B
Distribution Limits
Public
Copyright
Public Use Permitted.
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