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Stable, Thermally Conductive Fillers for Bolted JointsA commercial structural epoxy [Super Koropon (or equivalent)] has been found to be a suitable filler material for bolted joints that are required to have large thermal conductances. The contact area of such a joint can be less than 1 percent of the apparent joint area, the exact value depending on the roughnesses of the mating surfaces. By occupying the valleys between contact peaks, the filler widens the effective cross section for thermal conduction. In comparison with prior thermal joint-filler materials, the present epoxy offers advantages of stability, ease of application, and -- as a byproduct of its stability -- lasting protection against corrosion. Moreover, unlike silicone greases that have been used previously, this epoxy does not migrate to contaminate adjacent surfaces. Because this epoxy in its uncured state wets metal joint surfaces and has low viscosity, it readily flows to fill the gaps between the mating surfaces: these characteristics affect the overall thermal conductance of the joint more than does the bulk thermal conductivity of the epoxy, which is not exceptional. The thermal conductances of metal-to-metal joints containing this epoxy were found to range between 5 and 8 times those of unfilled joints.
Document ID
20110024124
Acquisition Source
Johnson Space Center
Document Type
Other - NASA Tech Brief
Authors
LeVesque, Raymond J., II
(McDonnell-Douglas Corp. Houston, TX, United States)
Jones, Cherie A.
(McDonnell-Douglas Corp. Houston, TX, United States)
Babel, Henry W.
(McDonnell-Douglas Corp. Houston, TX, United States)
Date Acquired
August 25, 2013
Publication Date
August 1, 2003
Publication Information
Publication: NASA Tech Briefs, August 2003
Subject Category
Structural Mechanics
Report/Patent Number
MSC-23066
Report Number: MSC-23066
Distribution Limits
Public
Copyright
Public Use Permitted.
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