Micro-Slit Collimators for X-Ray/Gamma-Ray Imaging

A hybrid photochemical-machining process is coupled with precision stack lamination to allow for the fabrication of multiple ultra-high-resolution grids on a single array substrate. In addition, special fixturing and etching techniques have been developed that allow higher-resolution multi-grid collimators to be fabricated. Building on past work of developing a manufacturing technique for fabricating multi-grid, high-resolution coating modulation collimators for arcsecond and subarcsecond x-ray and gamma-ray imaging, the current work reduces the grid pitch by almost a factor of two, down to 22 microns. Additionally, a process was developed for reducing thin, high-Z (tungsten or molybdenum) from the thinnest commercially available foil (25 microns thick) down to approximately equal to 10 microns thick using precisely controlled chemical etching