The NTF Inlet Guide Vanes Thermal Gradient Problem and Its MitigationThe National Transonic Facility (NTF) utilizes Inlet Guide Vanes (IGV) to provide precise, quick response Mach number control for the tunnel. During cryogenic operations, the massive IGV structure can experience large thermal gradients, measured as "Delta T or (Delta)T", between the IGV ring and its support structure called the transfer case. If these temperature gradients are too large, the IGV structure can be stressed beyond its safety limit and cease operation. In recent years, (Delta)T readings exceeding the prescribed safety limits were observed frequently during cryogenic operations, particularly during model access. The tactical operation methods of the tunnel to minimize (Delta)T did not always succeed. One obvious option to remedy this condition is to warm up the IGV structure by disabling the main drive operation, but this "natural" warm up method can takes days in some cases, resulting in productivity loss. This paper documents the thermal gradient problem associated with the IGV structure during cryogenic operation and how the facility has recently achieved an acceptable mitigation which has resulted in improved efficiency of operations.
Document ID
20130003236
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Venkat, Venki S. (Analytical Services and Materials, Inc. Hampton, VA, United States)
Paryz, Roman W. (NASA Langley Research Center Hampton, VA, United States)
Bissett, Owen W. (Jacobs Technology, Inc. Hampton, VA, United States)
Kilgore, W. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 27, 2013
Publication Date
January 7, 2013
Subject Category
Research And Support Facilities (Air)
Report/Patent Number
AIAA Paper 2013-0868NF1676L-15738Report Number: AIAA Paper 2013-0868Report Number: NF1676L-15738
Meeting Information
Meeting: 51st AIAA Aerospace Sciences Meeting
Location: Grapevine, TX
Country: United States
Start Date: January 7, 2013
End Date: January 10, 2013
Sponsors: American Inst. of Aeronautics and Astronautics