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Evaluation of Delamination Onset and Growth Characterization Methods under Mode I Fatigue LoadingDouble-cantilevered beam specimens of IM7/8552 graphite/epoxy from two different manufacturers were tested in static and fatigue to compare the material characterization data and to evaluate a proposed ASTM standard for generating Paris Law equations for delamination growth. Static results were used to generate compliance calibration constants for reducing the fatigue data, and a delamination resistance curve, GIR, for each material. Specimens were tested in fatigue at different initial cyclic GImax levels to determine a delamination onset curve and the delamination growth rate. The delamination onset curve equations were similar for the two sources. Delamination growth rate was calculated by plotting da/dN versus GImax on a log-log scale and fitting a Paris Law. Two different data reduction methods were used to calculate da/dN. To determine the effects of fiber-bridging, growth results were normalized by the delamination resistance curves. Paris Law exponents decreased by 31% to 37% after normalizing the data. Visual data records from the fatigue tests were used to calculate individual compliance constants from the fatigue data. The resulting da/dN versus GImax plots showed improved repeatability for each source, compared to using averaged static data. The Paris Law expressions for the two sources showed the closest agreement using the individually fit compliance data.
Document ID
20130010557
Acquisition Source
Langley Research Center
Document Type
Technical Memorandum (TM)
Authors
Murri, Gretchen B.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 27, 2013
Publication Date
February 1, 2013
Subject Category
Composite Materials
Report/Patent Number
NASA/TM-2013-217966
NF1676L-16086
L-20229
Report Number: NASA/TM-2013-217966
Report Number: NF1676L-16086
Report Number: L-20229
Funding Number(s)
WBS: WBS 794072.02.07.03.03
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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