Stability of Atmospheric-Pressure Plasma Induced Changes on Polycarbonate SurfacesPolycarbonate films are subjected to plasma treatment in a number of applications such as improving adhesion between polycarbonate and silicon alloy in protective and optical coatings. The changes in surface chemistry due to plasma treatment have tendency to revert back. Thus stability of the plasma induced changes on polymer surfaces over desired time period is very important. The objective of this study was to examine the effect of ageing on atmospheric pressure helium-plasma treated polycarbonate (PC) sample as a function of treatment time. The ageing effects were studied over a period of 10 days. The samples were plasma treated for 0.5, 2, 5 and 10 minutes. Contact angle measurements were made to study surface energy changes. Modification of surface chemical structure was examined using, X-ray Photoelectron Spectroscopy (XPS). Contact angle measurements on untreated and plasma treated surfaces were made immediately, 24, 48, 72 and 96 hrs after treatment. Contact angle decreased from 93 deg for untreated sample to 30 deg for sample plasma treated for 10 minutes. After 10 days the contact angles for the 10 minute plasma treated sample increased to 67 deg, but it never reverted back to that of untreated surface. Similarly the O/C ratio increased from 0.136 for untreated sample to 0.321 for 10 minute plasma treated sample indication increase in surface energy.
Document ID
20130011157
Acquisition Source
Kennedy Space Center
Document Type
Conference Paper
Authors
Sharma, Rajesh (Arkansas Univ. Little Rock, AR, United States)
Holcomb, Edward (Arkansas Univ. Little Rock, AR, United States)
Trigwell, Steve (ASRC Aerospace Corp. Cocoa Beach, FL, United States)
Date Acquired
August 27, 2013
Publication Date
June 6, 2006
Subject Category
Nonmetallic Materials
Report/Patent Number
KSC-2006-051Report Number: KSC-2006-051
Meeting Information
Meeting: ESA/IEEE International Conference
Location: Berkeley, CA
Country: United States
Start Date: June 6, 2006
End Date: June 9, 2006
Sponsors: Institute of Electrical and Electronics Engineers