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NASA-DoD Lead-Free Electronics ProjectThe primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
Document ID
20130011655
Acquisition Source
Kennedy Space Center
Document Type
Presentation
Authors
Kessel, Kurt (International Trade Bridge, Inc. Cocoa Beach, FL, United States)
Date Acquired
August 27, 2013
Publication Date
June 13, 2007
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
KSC-2007-080
Report Number: KSC-2007-080
Meeting Information
Meeting: SMTA AIMS Harsh Environment Electronics Workshop
Location: Indianapolis, IN
Country: United States
Start Date: June 13, 2007
End Date: June 14, 2007
Distribution Limits
Public
Copyright
Public Use Permitted.

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