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NASA DOD Lead Free Electronics ProjectThe primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
Document ID
20130012057
Acquisition Source
Kennedy Space Center
Document Type
Presentation
Authors
Kessel, Kurt R. (International Trade Bridge, Inc. Cocoa Beach, FL, United States)
Date Acquired
August 27, 2013
Publication Date
March 17, 2008
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
KSC-2008-045
Report Number: KSC-2008-045
Meeting Information
Meeting: Cleaner, Sustainable Industrial Materials and Processes (C.S.I.M.P.) Workshop
Location: Coronado, CA
Country: United States
Start Date: March 17, 2008
End Date: March 20, 2008
Distribution Limits
Public
Copyright
Public Use Permitted.

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