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NASA-DoD Lead-Free Electronics ProjectThe primary technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: (1) Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIP]) assembled and reworked with lead-free alloys, (2) Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
Document ID
20130012849
Acquisition Source
Kennedy Space Center
Document Type
Presentation
Authors
Kessel, Kurt R. (International Trade Bridge, Inc. Cocoa Beach, FL, United States)
Date Acquired
August 27, 2013
Publication Date
October 5, 2009
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
KSC-2009-167
Report Number: KSC-2009-167
Meeting Information
Meeting: 2009 SMTA AIMS Harsh Environment Electronics Symposium
Location: San Diego, CA
Country: United States
Start Date: October 5, 2009
End Date: October 6, 2009
Funding Number(s)
CONTRACT_GRANT: NAS10-03029
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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