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Joining and Integration of Silicon Nitride Ceramics for Aerospace and Energy SystemsLight-weight, creep-resistant silicon nitride ceramics possess excellent high-temperature strength and are projected to significantly raise engine efficiency and performance when used as turbine components in the next-generation turbo-shaft engines without the extensive cooling that is needed for metallic parts. One key aspect of Si3N4 utilization in such applications is its joining response to diverse materials. In an ongoing research program, the joining and integration of Si3N4 ceramics with metallic, ceramic, and composite materials using braze interlayers with the liquidus temperature in the range 750-1240C is being explored. In this paper, the self-joining behavior of Kyocera Si3N4 and St. Gobain Si3N4 using a ductile Cu-based active braze (Cu-ABA) containing Ti will be presented. Joint microstructure, composition, hardness, and strength as revealed by optical microscopy, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), Knoop microhardness test, and offset compression shear test will be presented. Additionally, microstructure, composition, and joint strength of Si3N4/Inconel 625 joints made using Cu-ABA, will be presented. The results will be discussed with reference to the role of chemical reactions, wetting behavior, and residual stresses in joints.
Document ID
20130013143
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Singh, M.
(Ohio Aerospace Inst. Cleveland, OH, United States)
Asthana, R.
(Wisconsin Univ.-Stout Menomonie, WI, United States)
Date Acquired
August 27, 2013
Publication Date
January 18, 2009
Subject Category
Composite Materials
Report/Patent Number
E-17374
Meeting Information
Meeting: 33rd International Conference and Exposition on Advanced Ceramics and Composites
Location: Daytona Beach, FL
Country: United States
Start Date: January 18, 2009
End Date: January 23, 2009
Sponsors: American Ceramic Society
Funding Number(s)
CONTRACT_GRANT: NNC07TB09T
Distribution Limits
Public
Copyright
Public Use Permitted.
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