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Low-Melt Poly(Amic Acids) and Polyimides and Their UsesProvided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance polymers such as inflatables or solar panels applications. Also provided are methods and devices for repair of electrical insulation.
Document ID
20150003177
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Jolley, Scott T.
Gibson, Tracy L.
Williams, Martha K.
Parrish, Clyde F.
Parks, Steven L.
Date Acquired
March 18, 2015
Publication Date
January 7, 2014
Subject Category
Nonmetallic Materials
Electronics And Electrical Engineering
Report/Patent Number
Patent Number: US-Patent-8,623,253
Patent Application Number: US-Patent-Appl-SN-13/033,085
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-8,623,253
Patent Application
US-Patent-Appl-SN-13/033,085

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