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Creep Behavior and Durability of Cracked CMCTo understand failure mechanisms and durability of cracked Ceramic matrix composites (CMCs), Melt Infiltration (MI) SiCSiC composites with Sylramic-iBN fibers and full Chemical vapour infiltration SiCSiC composites with Sylramic-ion bombarded BN (iBN) and Hi-Nicalon -S fibers were pre-cracked between 150 to 200 megapascal and then creep and Sustained Peak Low Cycle Fatigue (SPLCF) tested at 13150 C at stress levels from 35 to 103 megapascal for up to 200 hours under furnace and burner rig conditions. In addition creep testing was also conducted on pre-cracked full Chemical vapour infiltration SiCSiC composites at 14500 C between 35 and 103 megapascal for up to 200 hours under furnace conditions. If the specimens survived the 200 hour durability tests, then they were tensile tested at room temperature to determine their residual tensile properties. The failed specimens were examined by Scanning electron microscope (SEM) to determine the failure modes and mechanisms. The influence of crack healing matrix, fiber types, crack density, testing modes and interface oxidation on durability of cracked Ceramic matrix composites (CMCs) will be discussed.
Document ID
20150004096
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Bhatt, R. T.
(Ohio Aerospace Inst. Cleveland, OH, United States)
Fox, Dennis
(NASA Glenn Research Center Cleveland, OH United States)
Smith, Craig
(NASA Glenn Research Center Cleveland, OH, United States)
Date Acquired
April 2, 2015
Publication Date
January 1, 2015
Subject Category
Composite Materials
Report/Patent Number
GRC-E-DAA-TN20646
Meeting Information
Meeting: Annual Conference on Composites, Materials, and Structures
Location: Cocoa Beach, FL
Country: United States
Start Date: January 26, 2015
End Date: January 30, 2015
Sponsors: United States Advanced Ceramics Association
Funding Number(s)
WBS: WBS 109492.02.03.02.02.01
CONTRACT_GRANT: NNC13BA10B
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
Creep
CMC
Stress
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