NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
Understanding Key Reliability Factors IPC SpecificationsNo abstract available
Document ID
20150008201
Acquisition Source
Jet Propulsion Laboratory
Document Type
Presentation
External Source(s)
hdl:2014/44540
Authors
Ghaffarian, Reza (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
May 15, 2015
Publication Date
November 13, 2013
Subject Category
Quality Assurance And Reliability
Engineering (General)
Meeting Information
Meeting: IPC Conference on Solder and Reliability: Process and Test
Location: Costa Mesa, CA
Country: United States
Start Date: November 13, 2013
End Date: November 14, 2013
Sponsors: IPC-Association Connecting Electronics Industries
Distribution Limits
Public
Copyright
Other
Keywords
thermal shock
system to chip levels

Available Downloads

There are no available downloads for this record.

Related Records

There are no records associated with this record.
No Preview Available