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Applications of Fracture Mechanics to Accelerated Testing of Plastic Encapsulated MicroelectronicsNo abstract available
Document ID
20150018114
Acquisition Source
Headquarters
Document Type
Presentation
Authors
Evans, John (NASA Headquarters Washington, DC United States)
Tumlinson, Jessica Stack (Southwest Research Inst. San Antonio, TX, United States)
Date Acquired
September 17, 2015
Publication Date
July 12, 2015
Subject Category
Structural Mechanics
Report/Patent Number
HQ-E-DAA-TN25098
Meeting Information
Meeting: IEEE Conference on Accelerated Stress Testing & Reliability (ASTR)
Location: Cambridge, MA
Country: United States
Start Date: September 9, 2015
End Date: September 11, 2015
Sponsors: Institute of Electrical and Electronics Engineers
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
fracture mechanics
plastic encapsulated
microelectronics

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