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Low-Melt Poly(amic Acids) and Polyimides and Their UsesProvided are low-melt polyimides and poly(amic acids) (PAAs) for use in repair of electrical wire insulation, flat or ribbon wire harnesses, and flat surfaces comprised of high-performance polymers such as inflatables or solar panels applications. Also provided are methods and devices for repair of electrical insulation.
Document ID
20150022097
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Jolley, Scott T.
Gibson, Tracy L.
Williams, Martha K.
Parrish, Clyde F.
Parks, Steven L.
Date Acquired
December 1, 2015
Publication Date
November 24, 2015
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
Patent Number: US-Patent-9,193,830
Patent Application Number: US-Patent-Appl-SN-14/093,680
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-9,193,830
Patent Application
US-Patent-Appl-SN-14/093,680

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