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High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging ApplicationsGold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.
Document ID
20150023058
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Chen, Liang-Yu (Ohio Aerospace Inst. Cleveland, OH, United States)
Neudeck, Philip G. (NASA Glenn Research Center Cleveland, OH United States)
Spry, David J. (NASA Glenn Research Center Cleveland, OH United States)
Beheim, Glenn M. (NASA Glenn Research Center Cleveland, OH United States)
Hunter, Gary W. (NASA Glenn Research Center Cleveland, OH United States)
Date Acquired
December 15, 2015
Publication Date
September 15, 2015
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
GRC-E-DAA-TN26670
Report Number: GRC-E-DAA-TN26670
Meeting Information
Meeting: 2015 Electronics Packaging Symposium
Location: Niskayuna, NY
Country: United States
Start Date: September 15, 2015
End Date: September 16, 2015
Sponsors: GE Global Research Center
Funding Number(s)
WBS: WBS 533127.02.01.03.02
TASK: NNC13TA90T
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
High temperature
Electronic packaging
HTCC

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