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Low-Melt Poly(Amic Acids) and Polyimides and Their UsesProvided are low-melt polyimides and poly(amic acids) (PAAs) for use as adhesives, and methods of using the materials for attaching two substrates. The methods typically form an adhesive bond that is hermetically sealed to both substrates. Additionally, the method typically forms a cross-linked bonding material that is flexible.
Document ID
20160008419
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Jolley, Scott T.
Gibson, Tracy L.
Williams, Martha K.
Parrish, Clyde F.
Snyder, Sarah J.
Date Acquired
July 5, 2016
Publication Date
June 14, 2016
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
Patent Application Number: US-Patent-Appl-SN-13/915,407
Patent Number: US-Patent-9,365,756
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-9,365,756
Patent Application
US-Patent-Appl-SN-13/915,407

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