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Electrical Performance of a High Temperature 32-I/O HTCC Alumina PackageNo abstract available
Document ID
20170000233
Acquisition Source
Glenn Research Center
Document Type
Presentation
Authors
Chen, Liang-Yu (Ohio Aerospace Inst. Cleveland, OH, United States)
Neudeck, Philip G. (NASA Glenn Research Center Cleveland, OH United States)
Spry, David J. (NASA Glenn Research Center Cleveland, OH United States)
Beheim, Glenn M. (NASA Glenn Research Center Cleveland, OH United States)
Hunter, Gary W. (NASA Glenn Research Center Cleveland, OH United States)
Date Acquired
January 4, 2017
Publication Date
May 10, 2016
Subject Category
Avionics And Aircraft Instrumentation
Air Transportation And Safety
Report/Patent Number
GRC-E-DAA-TN32098
Meeting Information
Meeting: International Conference on High Temperature Electronics
Location: Albuquerque, NM
Country: United States
Start Date: May 10, 2016
End Date: May 12, 2016
Sponsors: International Microelectronics Assembly and Packaging Society (iMAPS)
Funding Number(s)
WBS: WBS 811073.02.24.01.37
CONTRACT_GRANT: NNC13BA10B
Distribution Limits
Public
Copyright
Public Use Permitted.
Keywords
Packaging
dielectric performance
High temperature

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