Self-Healing Technologies for Wiring and Surfaces in Aerospace and Deep Space Exploration Applications

Self-healing technologies have been identified as critical technology gaps for future exploration. NASA and KSC have been working in this area for multiple years with established intellectual property; however, there are many challenges that remain in this area of research. How do we mimic what the body does so naturally when we as NASA have unique requirements? We have been investigating several mechanisms for self-healing: microencapsulation with a healant core to fill in voids in the case of mechanical puncture and flowable (or sealable)systems that have inherent chemical properties that allow the materials to flow back together when cut or damaged. The microcapsules containing healant have to be durable and robust, must be able to take high temperatures to meet NASA unique requirements, provide good capillary flow of the healant, and be small in diameters to fill in damage voids in thin films or surfaces. Sealable systems have to flow in a range of temperatures and yet be lightweight and chemically resistant. The systems currently being developed are based on polyimide and polyurethane matrices and have been studied for use in high performance wiring systems, inflatable systems, and habitation structures. Self-healing or self-sealing capability would significantly reduce maintenance requirements and increase the safety and reliability performance of critical systems. Advances in these self-healing technologies and some of the unique challenges needed to be overcome in order to incorporate a self-healing mechanism into wiring or thin films systems will be addressed.