Developing a 3-DOF Compliant Perching Arm for a Free-Flying Robot on the International Space StationThis paper presents the design and control of the 3-DOF compliant perching arm for the free-flying Astrobee robots that will operate inside the International Space Station (ISS). The robots are intended to serve as a flexible platform for future guest scientists to use for zero-gravity robotics research - thus, the arm is designed to support manipulation research. It provides a 1-DOF underactuated tendon-driven gripper capable of enveloping a range of objects of different shapes and sizes. Co-located RGB camera and LIDAR sensors provide perception. The Astrobee robots will be capable of grasping each other in flight, to simulate orbital capture scenarios. The arm's end-effector module is swappable on-orbit, allowing guest scientists to add upgraded grippers, or even additional arm degrees of freedom. The design of the arm balances research capabilities with Astrobee's operational need to perch on ISS handrails to reduce power consumption. Basic arm functioning and grip strength were evaluated using an integrated Astrobee prototype riding on a low-friction air bearing.
Document ID
20170009546
Acquisition Source
Ames Research Center
Document Type
Conference Paper
Authors
Park, In-Won (SGT, Inc. Moffett Field, CA, United States)
Smith, Marion F. (NASA Ames Research Center Moffett Field, CA, United States)
Sanchez, Hugo S. (NASA Ames Research Center Moffett Field, CA, United States)
Wong, Sze Wun (Columbia Univ. New York, NY, United States)
Piacenza, Pedro (Columbia Univ. New York, NY, United States)
Ciocarlie, Matei (Columbia Univ. New York, NY, United States)
Date Acquired
October 5, 2017
Publication Date
July 3, 2017
Subject Category
Cybernetics, Artificial Intelligence And RoboticsEngineering (General)
Report/Patent Number
ARC-E-DAA-TN46498Report Number: ARC-E-DAA-TN46498
Meeting Information
Meeting: IEEE International Conference on Advanced Intelligent Mechatronics
Location: Munich
Country: Germany
Start Date: July 3, 2017
End Date: July 7, 2017
Sponsors: Institute of Electrical and Electronics Engineers