Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Bar-Cohen, Avram (Raytheon Co. Arlington, VA, United States) Robinson, Franklin L. (NASA Goddard Space Flight Center Greenbelt, MD, United States) Deisenroth, David C. (Maryland Univ. College Park, MD, United States) Date Acquired
April 24, 2018
Publication Date
April 17, 2018
Subject Category
Fluid Mechanics And ThermodynamicsElectronics And Electrical Engineering Meeting Information
Meeting: International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC2018)
Location: Kuwana, Mie
Country: Japan
Start Date: April 17, 2018
End Date: April 21, 2018
Sponsors: Japan Institute of Electronics Packaging (JIEP)
Distribution Limits
Public
Copyright
Use by or on behalf of the US Gov. Permitted.
Keywords
microchannelembedded coolingmicrogaptwo-phase flowheat transferelectronics cooling