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NASA Electronic Parts and Packaging (NEPP) Program - Innovative EEE Parts Resource for the FutureThis presentation includes NASA Electronic Parts and Packaging (NEPP) Program future approaches, Radiation Hardness Assurance (RHA) examples.
Document ID
20180005659
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
Authors
Michael J Campola ORCID(Goddard Space Flight Center Greenbelt, Maryland, United States)
Rebekah A Austin ORCID(Goddard Space Flight Center Greenbelt, Maryland, United States)
Date Acquired
September 27, 2018
Publication Date
August 6, 2018
Subject Category
Electronics And Electrical Engineering
Report/Patent Number
GSFC-E-DAA-TN59754
2018-561-NEPP
Report Number: GSFC-E-DAA-TN59754
Report Number: 2018-561-NEPP
Meeting Information
Meeting: 37th Annual Small Satellite Conference (SmallSat)
Location: Logan, UT
Country: US
Start Date: August 5, 2023
End Date: August 10, 2023
Sponsors: Utah State University
Funding Number(s)
WBS: 817091.40.31.51.04
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
Single Expert
Keywords
Technology evaluation
NASA Electronic Parts and Packaging (NEPP) Program
Parts assurance

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