Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Robinson, Franklin L. (NASA Goddard Space Flight Center Greenbelt, MD, United States) Bar-Cohen, Avram (Maryland Univ. College Park, MD, United States) Date Acquired
October 24, 2018
Publication Date
August 27, 2018
Subject Category
Electronics And Electrical Engineering Report/Patent Number
GSFC-E-DAA-TN56408Report Number: GSFC-E-DAA-TN56408 Meeting Information
Meeting: International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Location: San Francisco, CA
Country: United States
Start Date: August 28, 2018
End Date: August 30, 2018
Sponsors: American Society of Mechanical Engineers
Distribution Limits
Public
Copyright
Use by or on behalf of the US Gov. Permitted.
Keywords
orientationand gravitymicrogapmicrochannelFlow boilinginclinationnucleation