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Planar Via-Less Crossover Having Coplanar Waveguide Configurations and Stub LayersA via-less crossover for use in broadband microwave/mm-wave circuitry, including: a dielectric substrate; a top layer disposed on one side of the substrate and including a microstrip line with an input and an output, two tapered sections placed around the microstrip line along a co-planar waveguide (CPW) central line, one microstrip portion having an input and which connects to one top layer, rectangular stub disposed adjacent to one of the tapered sections, and another microstrip portion having an output and which connects to another top layer, rectangular stub disposed adjacent to the other of the tapered sections; and a ground layer disposed on an opposite side of the substrate and including a bottom layer CPW central line situated in a central cutout and which connects between a bottom layer, rectangular stub on one side and a bottom layer, rectangular stub on the other side situated in ground cutouts, respectively.
Document ID
20190000761
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
U-Yen, Kongpop
Wollack, Edward J.
Castro, Marc
Date Acquired
February 14, 2019
Publication Date
December 4, 2018
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-10,147,992
Patent Application
US-Patent-Appl-SN-15/194,747
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