Auto-Gopher-2 – An Autonomous Wireline Rotary Piezo-Percussive Deep Drilling Mechanism

Drilling deep into the subsurface of planetary bodies in the Solar System for samples acquisition enables critical capabilities for future NASA exploration missions in its quest to understand the origins of the Solar System and potentially the search for life. Such planetary bodies as Mars and Europa are key targets for potential missions that would require reaching great depths. Performing drilling while using minimal mass/volume systems and with low energy consumption are the main requirements that are imposed on such technologies. A wireline deep drill, called Auto-Gopher-2, is currently being developed as a joint effort between JPL and Honeybee Robotics Ltd. The Auto-Gopher II is a wireline rotary piezo-percussive deep drilling mechanism that combines formation breaking by rotating and piezoelectric actuator hammering and cuttings removal by rotating a fluted bit. The hammering mechanism is based on the Ultrasonic/Sonic Drill/Corer (USDC) mechanism that has been developed as an adaptable tool for many drilling and coring applications. The USDC uses an intermediate ball-shape free-mass to transform high frequency vibrations of a piezoelectric transducer horn tip into sonic hammering of the drill bit. The lessons learned from the previous studies are being implemented into the development of the Auto-Gopher-II, an autonomous deep wireline drill with integrated cuttings and sample management and drive electronics. Subsystems of the wireline drill are being developed in parallel at JPL and Honeybee Robotics, Ltd. Issues related to the bit and its ability to retain the cuttings for caching and removal are currently being addressed. This paper presents the development efforts of the piezoelectric actuator, cuttings removal and retention flutes and drive electronics.