The Effect of Impact Damage Next to Holes on the Bearing Strength of Carbon Fiber Laminates

This study was undertaken as a follow-on to a previous study that examined the effect of hole quality in the bearing strength of carbon fiber laminates. After the author of that previous study had established that hole quality had little effect on the ultimate bearing strength for carbon fiber laminates, the question was raised as to the effects of impact damage next to a hole on the bearing strength of that hole. While this is an unlikely scenario, it is still possible that this may occur on a launch vehicle structure and thus warranted study. After a literature review, results of a few studies on the hole-impact interaction with respect to resulting damage for carbon fiber laminates were found, but none that specifically addressed the resulting bearing strength. In reference 2, it was found that the holes and impact could interact to develop matrix splits. However, the lay-ups used in this study consisted of clumped plies [04/904]S, which are much more prone to matrix splitting than a laminate that would actually be used in practice (such as a lay-up of [0/90]4S). This study also focused on the analytical aspects of the problem rather than the experimental results. Reference 3 also used [04/904]S laminates (clumped plies) and examined the damage morphology, determining that, as the impact damage neared the hole, the damage zone became more asymmetrical. The effect this would have on bearing strength was not addressed. The experimental work presented in this study was to develop empirical data relating holeimpact damage effects on the resulting bearing strength of a commonly used (quasi-isotropic) lay-up of carbon fiber laminate. The emphasis was not on the morphology of the resulting damage, as it was in references 2 and 3, but rather on the practical aspects of how this damage affected the bearing strength and how this compared to the companion study1 on the effect of hole quality on the bearing strength of the laminate.