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Tin Whisker Growth on Sn77.2-In20-Ag2.8 Solder
Document ID
20205000814
Acquisition Source
Goddard Space Flight Center
Document Type
Presentation
External Source(s)
Authors
Lyudmyla Panashchenko
(Goddard Space Flight Center Greenbelt, Maryland, United States)
Date Acquired
April 13, 2020
Subject Category
Metals And Metallic Materials
Meeting Information
Meeting: 2018 CMSE Components for Military & Space Electronics Training & Exhibition
Location: Los Angeles, CA
Country: US
Start Date: May 7, 2018
End Date: May 10, 2018
Sponsors: Components Technology Institute, Inc.
Funding Number(s)
OTHER: 2018-562-NEPP
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Technical Review
Single Expert
Keywords
Tin Whisker
whisker growth
solder
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