Study of Fallout Metrics for Contamination Analysis

A challenge present in assessing contamination accumulation on many missions is predicting fallout during ground processing given the multiple and various orientations possible for surfaces such as optics and instruments. The best practice assumption has been to quantify particle build up on vertical surfaces as approximately 1/10 that of horizontal surfaces. This fractional relation is important when considering contamination allocations necessary to meet cleanliness requirements since spacecraft can be in many orientations during integration and testing. There is insufficient data to provide confidence in the 1/10 approximation, yet its use can have a significant effect on mission end of life contamination level predictions, leading to expenditures of precious resources to meet mission requirements.
A study was conducted to compare and analyze the fallout in horizontal and vertical orientations. Silicon wafers were deployed in four different facilities. Data sets from a long term deployment of wafers were analyzed from a cleanroom facility housing integration of the James Webb Space Telescope (JWST) as well as from a shorter term deployment of wafers in three cleanroom facilities at Goddard Space Flight Center with lower activity. There are many variables influencing the relationship between fallout on vertical and horizontal wafers, including wafer position with respect to air flow, air changes in the facility, duration of exposure, and activity workload. The goal of this continuing study is to develop a tool to inform particulate accumulation predictions for future projects.