NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login

Press Enter or click the Search button to begin your search.

Back to Results
Assembly Reliability of Ball Grid Array and Chip Scale Packages for High Reliability ApplicationsDifferent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Document ID
20210001173
Acquisition Source
Jet Propulsion Laboratory
Document Type
Other
External Source(s)
hdl:2014/22721
Authors
Ghaffarian, R.
Date Acquired
March 21, 1998
Publication Date
March 21, 1998
Publication Information
Publisher: UNKNOWN
Distribution Limits
Public
Copyright
Other
Technical Review
Keywords
BGA
miniaturization
trends
chip
scale
packages
CSP
assembly
reliabity
BGA
test
vehicle
configuration

Available Downloads

There are no available downloads for this record.

Related Records

There are no records associated with this record.
No Preview Available